Operating Specifications for Soldering Iron Tips

1. Before Use

  • Do not file, grind, or otherwise abrade the soldering iron tip, as this will damage the electroplated protective layer and significantly reduce tip lifespan.

  • During initial heating, fully coat the tip surface with fresh solder to remove surface oxides and ensure proper wetting.

2. During Use

  • Use low-corrosive or neutral flux whenever possible to minimize chemical erosion of the tip.

  • Clean the tip only with a water-moistened cleaning sponge or brass cleaner. Do not wipe the tip with cloth or abrasive materials.

  • Keep the working surface of the tip properly tinned at all times. Clean the tip only immediately before soldering, and re-tin it promptly after use to maintain a protective solder layer.

  • If the tip temperature reaches or exceeds 350 °C and soldering operations are paused for more than one hour, re-tin the tip periodically to prevent oxidation.

3. After Use

  • Do not remove excess solder from the tip before powering off the soldering station. As the tip cools, the retained solder forms a protective coating that helps prevent oxidation.

  • Except for threaded tip designs, do not use anti-seize compounds or solder, as these may interfere with normal tip performance.

  • If tip seizing occurs, attempt removal while the tip still retains residual heat. To prevent seizing, detach the tip from the soldering iron at regular intervals as part of routine maintenance.